Kingston Technology FURY Beast memory module 64 GB 2 x 32 GB DDR5 6000 MT/s

64GB 6000MT/s DDR5 CL30 DIMM (Kit of 2) FURY Beast White EXPO

Key Features

• Improved stability for overclocking
• Increased efficiency
• Intel® XMP 3.0 Certified
• AMD EXPO certified
• Qualified by the world’s leading motherboard manufacturers*
• Low-profile heat spreader design in black or white

Description

Up to 6800MT/s
Kingston FURY™ Beast DDR5 memory provides superb speed, capacity and reliability for next-gen gaming platforms. Level up your machine’s performance with enhanced features like on-die ECC for better stability and dual 32-bit subchannels to boost efficiency. Kingston FURY Beast DDR5 offers overclock specs for Intel® XMP 3.0 and AMD EXPO™ with customisable profiles for speeds and timings to help you wring the most from your gaming experience, livestream at 4K+ or push animation and 3D rendering projects.

Kingston FURY™ Beast DDR5 memory brings the latest, cutting-edge technology for next-gen gaming platforms. Taking speed, capacity and reliability even further, DDR5 arrives with an arsenal of enhanced features, like on-die ECC (ODECC) for improved stability at extreme speeds, dual 32-bit subchannels for increased efficiency and an on-module power management integrated circuit (PMIC) to provide juice where it’s needed most.

Superior speed advancements, with double the banks from 16 to 32 and double the burst length from 8 to 16, take DDR5 memory, your gaming experience and your overall system applications to the next level of performance.
Whether you’re pushing the limits in your gaming with the most extreme settings, live streaming at 4K+ or pushing large animation and 3D rendering, Kingston FURY Beast DDR5 memory is the level-up needed, while seamlessly bridging style and unleashing performance.

With options featuring Intel XMP 3.0 or AMD EXPO, two new DDR5 overclock specs that include customisable profiles for speeds and timings, Kingston FURY Beast DDR5 has your compatible overclock solutions covered."

Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain the ultimate performance while you push the limits!

Increased efficiency
Boosted by double the banks and burst length and two independent 32-bit subchannels, DDR5’s exceptional handling of data shines with the latest games, programs and demanding applications.

Intel® XMP 3.0 certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.

AMD EXPO certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice.

Qualified by the world’s leading motherboard manufacturers*
Tested and approved so you can build and upgrade with confidence on your preferred motherboard.

Low-profile heat spreader
Newly designed heat spreaders in black or white combine bold styling and outstanding cooling functionality.

Specifications

Power
Memory voltage	1.35 V
Design
Backlight	No
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	30
Memory voltage	1.35 V
Lead plating	Gold
SPD profile	Yes
ECC	No
Internal memory type	DDR5
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Backlight	No
Product colour	White
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	30
Memory voltage	1.35 V
Lead plating	Gold
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR5
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.0
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	3.75" (95.2 mm)
Package depth	0.55" (14 mm)
Package height	6.75" (171.4 mm)
Width	0.261" (6.62 mm)
Depth	5.25" (133.3 mm)
Height	1.37" (34.9 mm)
Weight	2.44 oz (69.2 g)
Package weight	3.59 oz (101.7 g)
Packaging data
Package width	3.75" (95.2 mm)
Package depth	0.55" (14 mm)
Package height	6.75" (171.4 mm)
Package weight	3.59 oz (101.7 g)
Logistics data
Master (outer) case width	8" (203.2 mm)
Master (outer) case length	12.2" (311.1 mm)
Master (outer) case height	4" (101.6 mm)
Master (outer) case gross weight	6.06 lbs (2.75 kg)
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan