64GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) FURY Impact PnP
Key Features
- Mighty DDR5 SODIMM performance
- Plug N Play automatic overclocking functionality**
- Intel® XMP 3.0 Certified
- Low power consumption, increased efficiency
- Improved stability with on-die ECC
Description
Your notebook or small-form-factor machine can now experience the latest, cutting-edge memory technology with Kingston FURY™ Impact DDR5. With Intel® XMP 3.0 Certified SODIMM kit capacities of up to 64GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. On Plug N Play* enabled modules, Kingston FURY Impact DDR5 automatically overclocks, giving your system a boost in performance without having to enable a profile. Modules featuring XMP 3.0 profiles can overclock to the highest frequency published, up to 6400MT/s, by selecting the profile in BIOS settings.
Mighty DDR5 SODIMM performanceWith a starting speed of 4800MT/s, DDR5 is 50% faster than DDR4 for a boost in gaming, rendering, and multitasking.
Plug N Play automatic overclocking functionality* Kingston FURY Impact DDR5’s PnP modules automatically overclock to the highest listed speed.
Intel® XMP 3.0 Certified Maximise memory performance with advanced pre-optimised timings, speed and voltage for overclocking.
Low Power Consumption, Increased efficiencyKeep your system cool and efficient with Kingston FURY Impact DDR5’s low power draw.
Improved stability with on-die ECCMaintain data integrity while hitting overclocking speeds.
Specifications
| Power |
| Memory voltage |
1.1 V |
| Design |
| Cooling type |
Heatsink |
| JEDEC standard |
Yes |
| Technical details |
| Country of origin |
China, Taiwan |
| Cooling type |
Heatsink |
| Memory |
| Buffered memory type |
Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Memory layout (modules x size) |
2 x 32 GB |
| Internal memory |
64 GB |
| Component for |
Laptop |
| Memory form factor |
262-pin SO-DIMM |
| CAS latency |
40 |
| Memory voltage |
1.1 V |
| Lead plating |
Gold |
| Module configuration |
4096M x 64 |
| Row cycle time |
48 ns |
| Refresh row cycle time |
295 ns |
| Row active time |
28.56 ns |
| SPD profile |
Yes |
| Memory ranking |
2 |
| ECC |
No |
| Internal memory type |
DDR5 |
| Programming power voltage (VPP) |
1.8 V |
| Features |
| On-Die ECC |
Yes |
| Buffered memory type |
Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Memory layout (modules x size) |
2 x 32 GB |
| Internal memory |
64 GB |
| Component for |
Laptop |
| Memory form factor |
262-pin SO-DIMM |
| CAS latency |
40 |
| Memory voltage |
1.1 V |
| Lead plating |
Gold |
| Module configuration |
4096M x 64 |
| Row cycle time |
48 ns |
| Refresh row cycle time |
295 ns |
| Row active time |
28.56 ns |
| SPD profile |
Yes |
| Country of origin |
China, Taiwan |
| Cooling type |
Heatsink |
| Memory ranking |
2 |
| ECC |
No |
| Internal memory type |
DDR5 |
| Programming power voltage (VPP) |
1.8 V |
| JEDEC standard |
Yes |
| Memory data transfer rate |
5600 MT/s |
| Operational conditions |
| Operating temperature (T-T) |
0 - 85 °C |
| Storage temperature (T-T) |
-55 - 100 °C |
| Weight & dimensions |
| Package width |
3.75" (95.2 mm) |
| Package depth |
0.55" (14 mm) |
| Package height |
6.75" (171.4 mm) |
| Width |
0.15" (3.8 mm) |
| Depth |
2.74" (69.6 mm) |
| Height |
1.18" (30 mm) |
| Weight |
0.705 oz (20 g) |
| Package weight |
1.63 oz (46.2 g) |
| Packaging data |
| Package width |
3.75" (95.2 mm) |
| Package depth |
0.55" (14 mm) |
| Package height |
6.75" (171.4 mm) |
| Package weight |
1.63 oz (46.2 g) |
| Logistics data |
| Master (outer) case width |
8" (203.2 mm) |
| Master (outer) case length |
12.2" (311.1 mm) |
| Master (outer) case height |
4" (101.6 mm) |
| Master (outer) case gross weight |
3.02 lbs (1.37 kg) |
| Products per master (outer) case |
25 pc(s) |
| Other features |
| Country of origin |
China, Taiwan |