Kingston Technology FURY Beast RGB memory module 64 GB 2 x 32 GB DDR5 6000 MT/s

64GB 6000MT/s DDR5 CL36 DIMM (Kit of 2) FURY Beast RGB EXPO

Key Features

• Enhanced RGB lighting with new heat spreader design*
• Patented Kingston FURY Infrared Sync Technology™
• Intel® XMP 3.0 Certified
• AMD EXPO certified
• Qualified by the world’s leading motherboard manufacturers**
• Improved stability for overclocking

Description

Kingston FURY™ Beast DDR5 RGB Memory - up to 6800MT/s
Kingston FURY™ Beast DDR5 RGB delivers speeds of up to 6800MT/s. Featuring Infrared Sync Technology™ to keep the vibrant customisable lighting in perfect sync, available with sleek black or white heat spreaders and support for Intel® XMP 3.0 and AMD EXPO™, it’s 100% speed tested and backed by a limited lifetime warranty.

Kingston FURY™ Beast DDR5 RGB* lets you overclock in style on next-gen gaming platforms with cutting-edge technology. Experience the superior speed advancements of DDR5 with double the banks and double the burst length.

Vibrant RGB lighting customisable with Kingston FURY CTRL software and patented Infrared Sync TechnologyTM, along with the new heat spreader designs in black or white, sets you apart in and out of the game.

Kingston FURY Beast DDR5 RGB features Intel XMP 3.0 or AMD EXPO options, two new DDR5 overclock specs that include customisable profiles for speeds and timings. 100% tested at speed and backed by a limited lifetime warranty.

Enhanced lighting with new heat spreader design
Game in style by customising the black or white heat spreaders with the smooth, stunning range of 18 RGB lighting* effects using Kingston FURY CTRL™ or the motherboard manufacturer’s software.

Patented Kingston FURY Infrared Sync Technology™
Vibrant RGB effects light in unison with Kingston’s patented Infrared Sync Technology.

Intel® XMP 3.0 certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.

AMD EXPO certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice.

Qualified by the world’s leading motherboard manufacturers**
Tested and trusted for your preferred motherboard so you can build with confidence.

Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain ultimate performance

Specifications

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.0
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	4.8" (121.9 mm)
Package depth	0.55" (14 mm)
Package height	6.75" (171.4 mm)
Width	0.28" (7.11 mm)
Depth	5.25" (133.3 mm)
Height	1.66" (42.2 mm)
Weight	3.05 oz (86.4 g)
Package weight	4.7 oz (133.1 g)
Packaging data
Package width	4.8" (121.9 mm)
Package depth	0.55" (14 mm)
Package height	6.75" (171.4 mm)
Package weight	4.7 oz (133.1 g)
Logistics data
Master (outer) case width	7.15" (181.6 mm)
Master (outer) case length	10" (254 mm)
Master (outer) case height	5.8" (147.3 mm)
Master (outer) case gross weight	4.83 lbs (2.19 kg)
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan