TG-30 Thermal Compound
Description
TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
High Thermal ConductivityThe thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Easy to ApplyThermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
All-In-One Application KitThis thermal compound application kit includes a set of easily-applied tools for immediate use.
Sustainability and SafetyThe high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.
Specifications
| Features |
|---|
| Type |
Thermal paste |
| Thermal conductivity |
4.5 W/m·K |
| Product colour |
Black |
| Packaging data |
|---|
| Quantity per pack |
1 pc(s) |
| Technical details |
|---|
| Thermal conductivity |
4.5 W/m·K |
| Colour |
|---|
| Product colour |
Black |
| Logistics data |
|---|
| Quantity per pack |
1 pc(s) |
